Summary

TEPro (TXC-06830) is a RISC processor-based device that supports the requirements of next-generation channelized DS3 access systems. TEPro integrates an M13 multiplexer, G.747 Mux/De-Mux framer, 28 DS1 / 21 E1 framers, T1/E1 cross connect and a 672 x 4,096-channel DS0 cross connect with an embedded high-performance microprocessor to provide a complete channelized DS3 solution on a single chip. The embedded processor firmware handles device drivers, data links, alarms, messaging, MIB performance objects, and signaling functions and allows communication to an external host via high-level API messages. The firmware is provided by TranSwitch and loaded from an external serial EEPROM at device boot-up.

The TEPro can be configured to support a variety of modes of operation, which allows for design flexibility. TEPro supports a combination of unframed DS1/E1, transmission DS1/E1 and H.100/H.110 bus or MVIP interfaces on the terminal side and either DS3 or DS1/E1 on the line side. For TDM applications, all 672 DS0 channels can be switched to any of the 4,096 H.100/H.110 bus channels. The TEPro can also be enabled to provide DS3 C-bit parity for unchannelized services. The on-chip firmware provides the control and management plane functionality to the host to configure, control and monitor all DS3, DS1, E1, DS0 and digital cross connect functions. The standards-based MIB functionality is provided for network management.

Applications

• T-carrier termination equipment: muxes, inverse muxes, cross connects, groomers
  
• CT (Computer Telephony) network interface boards
  
• VoP (Voice over Packet/Cell) gateways
  
• MSADs (Multi-Service Access Devices)
  
• DSLAMs (Digital Subscriber Loop Access Multiplexers)
  
• ECUs (Echo Cancellation Units)